MIXED BOARD (RF, ANALOG and DIGITAL):
60 X 115 MM
Board size
4GHz
High Speed
20
No of Layers
868
No of Components
2746
No of Nets
3680
No of Connections
02
No of Antenna path
5143
No of Pins
4(AD9364, Xilinx, BlackfinFlashProcessor and Microsemi FPGA)
No of FPGAs
11
DDR2 Memory Module
30 Days
Project Duration
Thermal Analysis
- Component temperature profile, board temperature profile and board gradient results
- Modelling heat sinks and thermal plates
Signal Integrity
- Stack-up design
- Pre-layout signal integrity analysis
- Post layout signal integrity analysis
- Eye diagram analysis
Power Integrity Analysis
- DC drop analysis
- Decoupling analysis
- Plane noise analysis
- EMI analysis
